High-performance custom anti-static shielding bags engineered to satisfy severe industrial standards, keeping delicate assemblies immune to electrostatic discharge.
Established in March 2018, ESD-PAC VINA has developed rapidly to become a prominent leader in the high-technology packaging sector. Located in the highly dynamic industrial center of Bac Ninh Province, Vietnam, our company seamlessly integrates cutting-edge engineering, advanced material formulation, raw material extrusion, and sterile converting processes. By implementing an uncompromising manufacturing ecosystem, we supply vital ESD shielding and custom barriers to the world's most demanding technology providers.
Our operational capabilities are built around our integrated research and development center, highly precise multi-layer co-extrusion technology, and state-of-the-art bag conversion machinery. We are much more than a packaging factory; we serve as structural engineering partners dedicated to addressing the complex and evolving risks of Electrostatic Discharge (ESD) and moisture-driven component failure in global supply chains.
A deep technical dive into the molecular and structural engineering required to generate permanent ESD barriers, Faraday shielding, and high-performance moisture barriers.
Our custom metalized shielding bags utilize a microscopic, vacuum-deposited aluminum core layer. This design creates a robust, highly conductive Faraday Cage structure. By distributing electrical charges across the outer boundaries, it keeps internal microcircuits safe from transient high-voltage ESD events.
Our anti-static aluminum foil bags combine dense, protective biaxially-oriented nylon (BOPA) with pure aluminum cores (AL) and high-density polyethylene (HDPE). This creates excellent moisture protection that meets IPC/JEDEC J-STD-033 standards, preventing solder defects like popcorn failure in high-humidity logistics.
Standard static-dissipative bags often depend on ambient moisture to work and can leave chemical residues behind. In contrast, our advanced polymer structures use high-purity, non-amine, non-corrosive dissipative agents. This ensures stable and reliable surface resistance across a broad range of temperatures and humidity conditions.
| Performance Metric / Property | Metalized Shielding Bag Spec | Aluminum Foil Barrier (MBB) Spec | CPE Frosted Anti-Static Bag Spec |
|---|---|---|---|
| Surface Resistivity (Inner/Outer) | 106 to 1010 Ohms/sq (ANSI/ESD STM11.11) | 106 to 1011 Ohms/sq (ANSI/ESD S20.20) | 108 to 1011 Ohms/sq (Non-Amine Polymer) |
| Electrostatic Shielding Energy | < 10 nJ (ANSI/ESD STM11.31) | < 2 nJ (ANSI/ESD STM11.31) | Static Dissipative (Triboelectric Resistant) |
| Static Decay Time | < 0.05 seconds (MIL-STD-3010) | < 0.02 seconds (MIL-STD-3010) | < 2.0 seconds (EIA-541) |
| Moisture Vapor Transmission (MVTR) | ≤ 0.35 g/100 sq.in/24h | ≤ 0.0003 g/100 sq.in/24h (Ultra-Barrier) | Not Applicable (Mechanical Dust Barrier) |
| Tensile & Puncture Strength | Moderate-High (BOPP/PE Base) | Exceptional (NY/AL/PE Heavy Lamination) | Flexible, High-Elongation (CPE Blend) |
Modern global logistics require strict supply chain safety plans and diverse sourcing strategies. Electronics companies and Tier-1 automotive suppliers are actively adopting a "Vietnam + 1" procurement model. This approach minimizes dependency on single countries, mitigates tariff risks, and ensures reliable material flow across borders.
By establishing our primary operations in the Quy Vu Industrial Park, Bac Ninh, Vietnam, ESD-PAC VINA occupies a highly competitive logistical position. We leverage excellent infrastructure and fast access to major shipping ports like Haiphong and international airports like Noi Bai, allowing us to export to North America, the European Union, Japan, South Korea, and Southeast Asia quickly and efficiently.
Furthermore, our integrated sourcing and raw material processing protect our clients from global supply shocks. Our focus on efficient resource management, clean production processes, and reduced waste aligns directly with the environmental goals of leading international corporations.
Every industry possesses distinct technical parameters and risk profiles. We construct custom packaging configurations specifically engineered to counter these specific environmental vulnerabilities.
Semiconductors and microchips are extremely vulnerable to minor static discharges and particulate contamination. Our custom packaging solutions prevent dust accumulation and static hazards to preserve raw silicon wafers, integrated circuits, and bare dies.
As modern vehicles adopt more electric drivetrains and ADAS tech, ESD risks increase. We manufacture heavy-duty, highly protective static shielding packaging designed to withstand long ocean transits and heavy vibrations.
In pharmaceutical and medical device manufacturing, maintaining absolute purity and stability is critical. Our sterile packaging solutions deliver high protection against light, moisture, and chemical interference, ensuring materials remain stable.
Every single production lot we manufacture undergoes strict, traceable testing in our analytical laboratory to ensure it meets strict international quality standards.
ESD-PAC VINA operates under strict international certifications, validating our engineering expertise and manufacturing precision. Our manufacturing protocols align with API 6D, API 607, CE, ISO 9001, ISO 14001, ISO 18001, and TS 16949 guidelines.
Our quality department tests every batch of raw film and finished bags. We measure thickness, sealing strength, layer adhesion, surface resistance, static decay time, and moisture transmission rate (MVTR). By keeping detailed test records, we provide full transparency and reliability to our global partners.
* If you need access to our original high-resolution certificates, technical datasheets, or quality test documents, please contact our team.
We focus on continuous innovation, researching and developing new packaging materials that improve protective performance while reducing environmental impact.
We are engineering bio-based, compostable, and post-consumer recycled (PCR) polymer films integrated with permanent static dissipative properties. This development helps electronics manufacturers reduce plastic waste without compromising on critical ESD safety.
We are designing advanced ESD packaging that integrates smart tech, like ultra-thin printed RFID tags and indicators that track temperature and moisture exposure. This helps supply chain managers monitor environmental conditions in real time during shipping.
Using advanced multi-layer nano-extrusion, we can manufacture thinner, lighter films that offer superior puncture resistance. This approach reduces overall material weight, decreases shipping costs, and keeps sharp electronic components secure.
Expert technical answers to common queries regarding electrostatics, moisture barriers, and custom procurement processes.
Standard anti-static bags (typically pink or blue polyethylene) are designed only to resist triboelectric charge generation; they do not shield components from external static fields. In contrast, static shielding bags feature a multi-layer design with a conductive metalized layer (Faraday Cage). This layer actively blocks high-voltage electrostatic fields, keeping highly sensitive electronic components safe from external discharges.
Surface Mount Devices (SMDs), such as microchips and high-density ICs, can absorb moisture from the air over time. During reflow soldering, this trapped moisture rapidly expands, which can crack components or damage their internal structures (known as the "popcorn effect"). High-performance Aluminum Foil Moisture Barrier Bags (MBB) offer an extremely low Moisture Vapor Transmission Rate (MVTR ≤ 0.0003g), shielding components from moisture ingress and ensuring high-quality solder joints.
Yes, we provide full custom manufacturing services. We tailor every aspect of our packaging—including dimensions, material combinations, seal widths, zipper types, and surface printing—to match your requirements. Our in-house printing services use clean, static-safe inks to keep the bag's surface resistivity stable, compliant with international standards, and completely legible.
We follow rigorous quality management standards, certified under ISO 9001 and ISO 14001. In our testing lab, we verify every production run using advanced equipment like surface resistance meters, static decay meters, and MVTR test systems. We test our materials in line with strict industrial standards, including ANSI/ESD S20.20, EIA-541, and MIL-STD-3010.
Typically, custom orders are completed within 10 to 18 days, depending on the material specs and quantity. Our modern, 12,000-square-meter facility in Bac Ninh, Vietnam, runs high-speed automated extrusion and bag-making equipment, enabling us to handle urgent bulk orders quickly.
Explore our full line of protective solutions below. Contact our engineering team for customized sizes, special materials, and custom printing services.
ESD-PAC VINA